Product Description

Vacuum Cavity Heat Plate technology is similar in principle to a heat pipe, but differs in the way it conducts heat. Heat pipe is a one-dimensional linear heat conduction, while the heat in the vacuum cavity heat plate is conducted on a two-dimensional surface, so the efficiency is higher.

Product parameters

Size: Maximum size: 400MMX 400MM

Thickness: 1.0mm (MM) or more

Substance: Refrigerant

Microstructure: Multi-layer fibre capillary structure, regionalisation of hole size design

Cavity material: Oxygen-free copper (C1100/C1020)

External structure: Oxygen-free copper (C1100/C1020)

Key Features:

• Uniform Heat Distribution: Minimizes temperature gradients across components.

• High Thermal Conductivity: Uses copper, aluminum, or graphite materials.

• Compact & Lightweight: Designed for space-saving applications.

• Compatible with Various Cooling Systems: Works with fans, heat pipes, or vapor chambers.

• Improves System Stability: Reduces risk of thermal stress and premature failure.

Typical Applications:

• Battery packs (especially in EVs and energy storage systems)

• CPUs, GPUs, and high-power chips

• Communication devices

• LED lighting systems

• Telecom base stations

• Power electronics and inverters

  
  

Characteristics

Low starting temperature; fast heat transfer; good temperature uniformity: high output power: low manufacturing cost; long service life, lighter weight.

Applications

is especially suitable for the heat dissipation needs in the narrow space environment where the height and space are strictly limited. Such as notebook computers, computer workstations and network servers. Very suitable for high junction temperatures, the need for rapid step-by-step cooling of the working environment. Such as high-power LED heat dissipation, semiconductor cooling wafer hot end heat dissipation and thermal power generation, the average temperature plate as a heat transfer element, can provide the electronics industry and a variety of other industries in the heat dissipation needs.

Structure

by the bottom plate and cover plate composed of a completely closed flat plate cavity, the cavity wall is equipped with liquid-absorbing capillary core structure, the capillary core structure can be wire mesh, micro-grooves, fibre filaments, but also metal powder sintered core and the composite combination of several structures. Cavity internal support structure is necessary to overcome the negative pressure due to vacuum caused by depression, heat rise, installation of pressure deformation. When the heat conduction to the evaporation area, the work material in the cavity in the low vacuum environment, will begin to produce the phenomenon of liquid-phase vapourization, at this time the work material to absorb heat energy and the volume of the rapid expansion of the vapour-phase work material will soon fill the entire cavity, when the vapour-phase work material contact with a colder region will produce the phenomenon of condensation, through the phenomenon of condensation to release the heat accumulated in the evaporation, after the liquid-phase condensation of the liquid-phase work material by microstructure capillary phenomenon and then the liquid-phase work material to the evaporation. After condensation, the liquid-phase substance returns to the heat source of evaporation through the capillary phenomenon of the microstructure, and this operation will be carried out again and again in the chamber, which is the operation mode of the equalisation plate. And because the microstructure can generate capillary force during the evaporation of the substance, the operation of the plate is not affected by gravity.

Product FAQ

Q1: What exactly does an equalisation plate module do?

A: It spreads heat evenly across the surface to prevent hot spots. This ensures all parts of a device maintain a balanced temperature, improving overall system performance and reliability.

Q2: What materials are used in equalisation plate modules?

A: Common materials include copper, aluminum, and synthetic graphite due to their high thermal conductivity and lightweight nature.

Q3: Is it the same as a heat sink?

A: Not exactly. While both manage heat, the equalisation plate spreads heat within a system, whereas a heat sink dissipates heat away from a system into the surrounding air.

Q4: Where is this module typically used?

A: It's widely used in battery modules (like EVs), industrial electronics, LED systems, and high-performance computing to ensure uniform heat transfer and extend component life.

Q5: Can it be customized for different sizes or layouts?

A: Yes, equalisation plate modules can be customized in size, thickness, material, and thermal specs to fit specific device requirements or space limitations.

Q6: How does it affect the lifespan of other cooling components?

A: By balancing the temperature load, it reduces the strain on fans, heat pipes, or thermal pads, helping them work more efficiently and last longer.

Q7: Do I still need fans or other cooling parts if I use this?

A: Yes, the equalisation plate works with other cooling elements. It doesn’t replace them but enhances their effectiveness by creating even thermal conditions.