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1. Product Introduction
The Vapor chamber module is an efficient Thermal Management Solution based on two-phase flow heat dissipation technology, achieving rapid homogenization of heat through the evaporation-condensation cycle of the internal working medium. Compared with traditional heat dissipation schemes, it has the advantages of high thermal conductivity (5,000-50,000 W/m·K), thin thickness (up to 0.3mm), and strong temperature uniformity (within ±1℃), and is specially designed for the heat dissipation requirements of high-power-density electronic devices.
2. Core Features:
Ultra-thin lightweight structure
Active temperature equalization technology
Customized shape design
No moving parts, zero noise
3. Product Functions
① High-efficiency temperature uniformity
Through the principle of phase change heat transfer, local hotspots are quickly eliminated, and the temperature difference is controlled within ±1℃ (the temperature difference of traditional heat sinks can reach ±10℃).
② Lightweight design
The 0.3mm ultra-thin solution can replace traditional metal heat sinks, saving more than 60% of space for compact devices.
③ Multi-directional heat dissipation
360° all-round heat conduction, breaking through the unidirectional heat transfer limitation of traditional heat pipes.
④ Customized compatibility
Supports drilling, bending, and irregular cutting, and is suitable for various PCB layouts.
4. Application Scenarios
4.1 Consumer Electronics
Heat dissipation of the motherboard of a smart phone or tablet
The average temperature of the CPU/GPU of the laptop
Thermal management of VR devices
4.2 Communication Equipment
5G base station AAU module
Heat dissipation of optical modules
Server chipset
4.3 New Energy and Automobiles
Thermal equalization of electric vehicle battery packs
Cooling of the on-board charger (OBC)
Cooling of IGBT power modules
4.4 Industry and Healthcare
Laser Heat Dissipation System
Cooling of medical imaging equipment
Industrial PLC controller
5. Common Questions
Q1: What are the advantages compared with traditional heat pipes?
A: The vapor chamber has two-dimensional heat dissipation capacity (while the heat pipe is only one-dimensional), a thinner thickness (up to 0.3mm), and a higher heat flux (up to 500W/cm²).
Q2: Does it support repeated bending processing?
A: Standard products are not recommended to be bent (which may damage the vacuum seal), but preformed customized solutions can be provided.
Q3: How to install it into the device?
A: It is recommended to use thermal conductive adhesive or welding for fixation. We provide installation guidelines and stress analysis support.
Q4: Will the working medium leak?
A: By adopting laser sealing technology and conducting helium mass spectrometry leak detection (leakage rate <1×10⁻⁸ Pa·m³/s), it ensures a lifespan of over 10 years.
Q5: What is the minimum order quantity (MOQ)?
A: 500pcs of the standard model MOQ and 1,000pcs of the customized solution MOQ. Sample applications are supported.
Q6: Is thermal simulation support provided?
A: We can provide FloTHERM/ANSYS simulation reports and assist customers in optimizing heat dissipation designs.
1. Product Introduction
The Vapor chamber module is an efficient Thermal Management Solution based on two-phase flow heat dissipation technology, achieving rapid homogenization of heat through the evaporation-condensation cycle of the internal working medium. Compared with traditional heat dissipation schemes, it has the advantages of high thermal conductivity (5,000-50,000 W/m·K), thin thickness (up to 0.3mm), and strong temperature uniformity (within ±1℃), and is specially designed for the heat dissipation requirements of high-power-density electronic devices.
2. Core Features:
Ultra-thin lightweight structure
Active temperature equalization technology
Customized shape design
No moving parts, zero noise
3. Product Functions
① High-efficiency temperature uniformity
Through the principle of phase change heat transfer, local hotspots are quickly eliminated, and the temperature difference is controlled within ±1℃ (the temperature difference of traditional heat sinks can reach ±10℃).
② Lightweight design
The 0.3mm ultra-thin solution can replace traditional metal heat sinks, saving more than 60% of space for compact devices.
③ Multi-directional heat dissipation
360° all-round heat conduction, breaking through the unidirectional heat transfer limitation of traditional heat pipes.
④ Customized compatibility
Supports drilling, bending, and irregular cutting, and is suitable for various PCB layouts.
4. Application Scenarios
4.1 Consumer Electronics
Heat dissipation of the motherboard of a smart phone or tablet
The average temperature of the CPU/GPU of the laptop
Thermal management of VR devices
4.2 Communication Equipment
5G base station AAU module
Heat dissipation of optical modules
Server chipset
4.3 New Energy and Automobiles
Thermal equalization of electric vehicle battery packs
Cooling of the on-board charger (OBC)
Cooling of IGBT power modules
4.4 Industry and Healthcare
Laser Heat Dissipation System
Cooling of medical imaging equipment
Industrial PLC controller
5. Common Questions
Q1: What are the advantages compared with traditional heat pipes?
A: The vapor chamber has two-dimensional heat dissipation capacity (while the heat pipe is only one-dimensional), a thinner thickness (up to 0.3mm), and a higher heat flux (up to 500W/cm²).
Q2: Does it support repeated bending processing?
A: Standard products are not recommended to be bent (which may damage the vacuum seal), but preformed customized solutions can be provided.
Q3: How to install it into the device?
A: It is recommended to use thermal conductive adhesive or welding for fixation. We provide installation guidelines and stress analysis support.
Q4: Will the working medium leak?
A: By adopting laser sealing technology and conducting helium mass spectrometry leak detection (leakage rate <1×10⁻⁸ Pa·m³/s), it ensures a lifespan of over 10 years.
Q5: What is the minimum order quantity (MOQ)?
A: 500pcs of the standard model MOQ and 1,000pcs of the customized solution MOQ. Sample applications are supported.
Q6: Is thermal simulation support provided?
A: We can provide FloTHERM/ANSYS simulation reports and assist customers in optimizing heat dissipation designs.
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